Thermal Interface Pads for Power Electronics

Dispense-Free ManufacturingDispense-Free Manufacturing

● Pad form factor
● Easily integrates into any size production line
● Eliminate re-torque process to prevent torque loss

Reliable, Consistent Thermal Performance

● Unaffected by extreme temperatures
● Unlimited performance lifetime

Residue-Free Repairs

● Eliminates grease clean-up and application
processes required to replace failed modules

HT-C3200 Icon for WebHITHERM™ HT-C3200 Thermal Interface Material (TIM) is the first of its kind, compressible graphite sheet with thermal performance that matches traditional thermal grease without pump-out and dry-out failure modes.

This breakthrough material was developed to address the reliability challenges of mission critical applications in extreme temperature environments and harsh duty cycles.

Power Device (Web)

HT-C3200 TIM Portfolio

Most popular thermal interfaces shown below.

EconoDUAL™ and PrimePACK™ are registered trademarks of Infineon Technology AG, Germany.

HT-C3200 TIM Portfolio





For more information, please complete and submit the form below.

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